Browsing by Subject "Adhesion"
Now showing items 1-6 of 6
-
Adhesion of copper to poly(tetrafluoroethylene) surfaces modified with vacuum UV radiation from helium arc plasma
(Springer-Verlag: Journal of Adhesion Science and Technology, 2003-12)Poly(tetrafluoroethylene) (PTFE) film surfaces were exposed to vacuum UV (VUV) radiation from He dc arc plasmas that were made to rotate inside a graphite tube by the application of an auxiliary magnetic field. The films ... -
Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma
(Springer-Verlag: Journal of Adhesion Science and Technology, 2004-12)Poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces were exposed to vacuum UV (VUV) photo-oxidation downstream from Ar microwave plasma. The modified surfaces showed the following: (1) an improvement in wettability ... -
Adhesion of copper to teflon surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma
(The American Chemical Society: Polymeric Materials Science and Engineering, 2004)Fluoropolymers, like Teflon(r) PTFE (polytetrafluoroethylene) and FEP (fluorinated ethylene-propylene co-polymer), have been extensively used in space applications, protective coatings, microelectronics packaging and ... -
Adhesion of copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces modified by vacuum UV photo-oxidation downstream from argon microwave plasma
(Materials Research Society Proceedings: Materials for Space Applications, 2005)Good practical adhesion of sputter-deposited Cu is achieved to poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces at short treatment times of vacuum UV (VUV) photo-oxidation downstream from Ar ... -
Surface modification of Teflon (R) PFA with vacuum UV photo-oxidation
(Brill Academic Publishers: Journal of Adhesion Science and Technology, 2006)Surface modification of poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) with vacuum UV (VUV) photo-oxidation using radiation from excited Ar atoms downstream from an At microwave (MW) plasma shows: (1) an ... -
Use of high-temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface-modified by an AC Nitrogen Glow-Discharge
(Brill (VSP): Journal of Adhesion Science and Technology, 1995)We have used an extreme environmental stress test to study the adhesion of a thin sputtered copper film (0.5 mu m) to flexible polyimide (PI) substrates between 25 and 125 mu m thick. The polyimide types include Kapton ...