Browsing by Subject "Plasma modification"
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Use of high-temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface-modified by an AC Nitrogen Glow-Discharge
(Brill (VSP): Journal of Adhesion Science and Technology, 1995)We have used an extreme environmental stress test to study the adhesion of a thin sputtered copper film (0.5 mu m) to flexible polyimide (PI) substrates between 25 and 125 mu m thick. The polyimide types include Kapton ...