Browsing Meeting minutes, announcements and publications from RIT Colleges by Subject "Lead-free solder paste"

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    • Effect of solder paste and surface finish on 0201 assembly process defects 

      Newasekar, Rahul; Ramkumar, S. Manian (SMTA: SMTA International Conference Proceedings, 2004)
      The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 and even smaller sized passive components. The size advantages of 0201 components make it a popular choice among ...