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Understanding hidden reactions and importance of profile in reflow soldering - part 1
(Global SMT and Packaging, 2008)
Understanding hidden reactions and the importance of profile in reflow soldering
(Global SMT and Packaging, 2008)
Industry academia partnership-sustaining growth and competitiveness
(PennWell Corporation: SMT Magazine, 2008)
Understanding hidden reactions and the importance of profile in reflow soldering
(Global SMT and Packaging, 2008)
Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
(ASME: Proceedings of the ASME InterPack Conference, 2007)
A Novel anisotropic conductive adhesive for lead-free surface mount electronics packaging
(ASME: Journal of Electronic Packaging, 2007)
Investigating the applicability of auto-focus option for optimal oven recipe selection for Pb-Free relow soldering
(Megan Wendling: Lead Free Magazine, 2007)
Lead free selective soldering process optimization
(SMTA: SMTA International Conference Proceedings, 2007)