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    Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes 

    Ramkumar, S. Manian; Kannabiran, Anand; Penmatsa, Sreekanth; Ghaffarian, Reza (ASME: Proceedings of the ASME InterPack Conference, 2007)
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    Investigation of the performance of SAC and SACBi lead-free Solder alloys with OSP and immersion silver PCB finishes 

    Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Anson, Scott (SMTA: SMTA International Conference Proceedings, 2005)
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    Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish 

    Ramkumar, S. Manian; Kannabiran, Anand; Pannerselvam, Elavarasan (SMTA: SMTA International Conference Proceedings, 2006)
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    A Novel anisotropic conductive adhesive for lead-free surface mount electronics packaging 

    Ramkumar, S. Manian; Srihari, Krishnaswami (ASME: Journal of Electronic Packaging, 2007)
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    Lead-free 0201 manufacturing, assembly and reliability test results 

    Ramkumar, S. Manian; Ghaffarin, Reza; Varanasi, Arun (Elsevier, 2006)
    The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 (L not, vert, similar 0.02 in.; W not, vert, similar 0.01 in.) and even smaller sized passive components. The size ...
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    Effect of deviating from the reflow process window for lead-free assembly 

    Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: Journal of Surface Mount Technology, 2005)
    The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ...
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    Effect of deviating from the reflow process window for lead-free assembly 

    Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: SMTA International Conference Proceedings, 2005)
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    Lead free selective soldering process optimization 

    Ramkumar, S. Manian; Pannerselvam, Elavarasan (SMTA: SMTA International Conference Proceedings, 2007)
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    Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive 

    Ramkumar, S. Manian; Srihari, Krishnaswami (ASME: Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2007)
    The need to eliminate lead-based materials as a means of interconnection has renewed the electronics industry's interest in using conductive adhesives for component attach, especially Anisotropic Conductive Adhesives (ACA). ...
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    Achieving increased productivity and profitability in an EMS environment using lean manufacturing tools and techniques 

    Ramkumar, S. Manian (SMTA: SMTA Pan Pacific Microelectronics Symposium, 2003)
    This research paper discusses the various aspects of lean manufacturing and its importance in electronics manufacturing service (EMS) provider environment. The philosophy of lean manufacturing and the various tools and ...
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    Author
    Ramkumar, S. Manian (38)
    Kannabiran, Anand (5)Anson, Scott (4)Edinbarough, Immanuel (4)Baskaran, Aarthi (3)Ghaffarian, Reza (3)Rajesnayagham, Santhakumar (3)Sampathkumar, Manivannan (3)Srihari, Krishnaswami (3)Ajmera, Abhinav (2)... View MoreSubjectReflow soldering (3)Thermal profiling (3)Intermetallic compound (2)Process parameters (2)Reflow process window (2)0201 Assembly (1)Anisotropic Conductive Adhesive (1)Anti-tombstoning paste (1)Cellular manufacturing (1)Contact Resistance (1)... View MoreDate Issued2000 - 2009 (28)1990 - 1999 (8)1987 - 1989 (2)Has File(s)Yes (36)No (2)

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