Search
Now showing items 1-10 of 38
Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
(ASME: Proceedings of the ASME InterPack Conference, 2007)
Investigation of the performance of SAC and SACBi lead-free Solder alloys with OSP and immersion silver PCB finishes
(SMTA: SMTA International Conference Proceedings, 2005)
Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish
(SMTA: SMTA International Conference Proceedings, 2006)
A Novel anisotropic conductive adhesive for lead-free surface mount electronics packaging
(ASME: Journal of Electronic Packaging, 2007)
Lead-free 0201 manufacturing, assembly and reliability test results
(Elsevier, 2006)
The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 (L not, vert, similar 0.02 in.; W not, vert, similar 0.01 in.) and even smaller sized passive components. The size ...
Effect of deviating from the reflow process window for lead-free assembly
(SMTA: Journal of Surface Mount Technology, 2005)
The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ...
Effect of deviating from the reflow process window for lead-free assembly
(SMTA: SMTA International Conference Proceedings, 2005)
Lead free selective soldering process optimization
(SMTA: SMTA International Conference Proceedings, 2007)
Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive
(ASME: Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2007)
The need to eliminate lead-based materials as a means of interconnection has renewed the electronics industry's interest in using conductive adhesives for component attach, especially Anisotropic Conductive Adhesives (ACA). ...
Achieving increased productivity and profitability in an EMS environment using lean manufacturing tools and techniques
(SMTA: SMTA Pan Pacific Microelectronics Symposium, 2003)
This research paper discusses the various aspects of lean manufacturing and its importance in electronics manufacturing service (EMS) provider environment. The philosophy of lean manufacturing and the various tools and ...