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Understanding hidden reactions and importance of profile in reflow soldering - part 1
(Global SMT and Packaging, 2008)
Understanding hidden reactions and the importance of profile in reflow soldering
(Global SMT and Packaging, 2008)
Understanding hidden reactions and the importance of profile in reflow soldering
(Global SMT and Packaging, 2008)
Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
(ASME: Proceedings of the ASME InterPack Conference, 2007)
Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish
(SMTA: SMTA International Conference Proceedings, 2006)