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Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
(ASME: Proceedings of the ASME InterPack Conference, 2007)
Effect of stencil and PCB parameters on 2001 assembly process defects
(37th International Symposium on Microelectronics Packaging, IMAPS 2004, 2004)
Print process characterization for fine pitch BGA devices
(SMTA: SMTA International Conference, 2001)