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Effect of stencil and PCB parameters on 2001 assembly process defects
(37th International Symposium on Microelectronics Packaging, IMAPS 2004, 2004)
Effect of solder paste and surface finish on 0201 assembly process defects
(SMTA: SMTA International Conference Proceedings, 2004)
The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 and even smaller sized passive components. The size advantages of 0201 components make it a popular choice among ...