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Lead-free 0201 manufacturing, assembly and reliability test results
(Elsevier, 2006)
The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 (L not, vert, similar 0.02 in.; W not, vert, similar 0.01 in.) and even smaller sized passive components. The size ...
Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish
(SMTA: SMTA International Conference Proceedings, 2006)
Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions
(39th International Symposium on Microelectronics Packaging, IMAPS 2006, 2006)