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A Novel anisotropic conductive adhesive for lead-free surface mount electronics packaging
(ASME: Journal of Electronic Packaging, 2007)
Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive
(ASME: Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2007)
The need to eliminate lead-based materials as a means of interconnection has renewed the electronics industry's interest in using conductive adhesives for component attach, especially Anisotropic Conductive Adhesives (ACA). ...
Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions
(39th International Symposium on Microelectronics Packaging, IMAPS 2006, 2006)