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Investigation of the performance of SAC and SACBi lead-free Solder alloys with OSP and immersion silver PCB finishes
(SMTA: SMTA International Conference Proceedings, 2005)
Effect of deviating from the reflow process window for lead-free assembly
(SMTA: Journal of Surface Mount Technology, 2005)
The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ...
Effect of deviating from the reflow process window for lead-free assembly
(SMTA: SMTA International Conference Proceedings, 2005)