Browsing Citations Only by Author "Ghaffarian, Reza"
Now showing items 1-3 of 3
-
Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
Ramkumar, S. Manian; Kannabiran, Anand; Penmatsa, Sreekanth; Ghaffarian, Reza (ASME: Proceedings of the ASME InterPack Conference, 2007) -
Effect of stencil and PCB parameters on 2001 assembly process defects
Ramkumar, S. Manian; Newasekar, Rahul; Ghaffarian, Reza (37th International Symposium on Microelectronics Packaging, IMAPS 2004, 2004) -
Print process characterization for fine pitch BGA devices
Ramkumar, S. Manian; Clouthier, Richard; Ghaffarian, Reza (SMTA: SMTA International Conference, 2001)