Browsing Citations Only by Author "Grande, William"
Now showing items 1-4 of 4
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Evaluation of single phase flow in microchannels for high flux chip cooling - Thermohydraulic performance enhancement and fabrication technology
Kandlikar, Satish; Grande, William (American Society of Mechanical Engineers (ASME), 2004-06)The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooled technology. Direct liquid cooling of chips is being considered as a viable alternative. This paper reviews ... -
Evaluation of single phase flow in microchannels for high heat flux chip cooling - thermohydraulic performance enhancement and fabrication technology
Kandlikar, Satish; Grande, William (Taylor & Francis, 2004)The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative. This paper reviews ... -
Evolution of microchannel flow passages – Thermohydraulic performance and fabrication technology
Kandlikar, Satish; Grande, William (Taylor & Francis, 2003)This paper provides a roadmap of development in the thermal and fabrication aspects of microchannels as applied in microelectronics and other high heat-flux cooling applications. Microchannels are defined as flow passages ... -
Evolution of microchannel flow passages – Thermohydraulic performance and fabrication technology
Kandlikar, Satish; Grande, William (Taylor & Francis, 2003-03-17)This paper provides a roadmap of development in the thermal and fabrication aspects of microchannels as applied in microelectronics and other high heat-flux cooling applications. Microchannels are defined as flow passages ...