Browsing Citations Only by Author "Kannabiran, Anand"
Now showing items 1-5 of 5
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Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
Ramkumar, S. Manian; Kannabiran, Anand; Penmatsa, Sreekanth; Ghaffarian, Reza (ASME: Proceedings of the ASME InterPack Conference, 2007) -
Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish
Ramkumar, S. Manian; Kannabiran, Anand; Pannerselvam, Elavarasan (SMTA: SMTA International Conference Proceedings, 2006) -
Understanding hidden reactions and importance of profile in reflow soldering - part 1
Ramkumar, S. Manian; Kannabiran, Anand; Baskaran, Aarthi (Global SMT and Packaging, 2008) -
Understanding hidden reactions and the importance of profile in reflow soldering
Ramkumar, S. Manian; Kannabiran, Anand; Baskaran, Aarthi; Puligandla, Viswam; Dahle, Bjorn (Global SMT and Packaging, 2008) -
Understanding hidden reactions and the importance of profile in reflow soldering
Ramkumar, S. Manian; Kannabiran, Anand; Baskaran, Aarthi (Global SMT and Packaging, 2008)