Browsing Citations Only by Author "Newasekar, Rahul"
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Effect of solder paste and surface finish on 0201 assembly process defects
Newasekar, Rahul; Ramkumar, S. Manian (SMTA: SMTA International Conference Proceedings, 2004)The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 and even smaller sized passive components. The size advantages of 0201 components make it a popular choice among ... -
Effect of stencil and PCB parameters on 2001 assembly process defects
Ramkumar, S. Manian; Newasekar, Rahul; Ghaffarian, Reza (37th International Symposium on Microelectronics Packaging, IMAPS 2004, 2004)