Browsing Citations Only by Author "Ramkumar, S. Manian"
Now showing items 1-20 of 38
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Achieving increased productivity and profitability in an EMS environment using lean manufacturing tools and techniques
Ramkumar, S. Manian (SMTA: SMTA Pan Pacific Microelectronics Symposium, 2003)This research paper discusses the various aspects of lean manufacturing and its importance in electronics manufacturing service (EMS) provider environment. The philosophy of lean manufacturing and the various tools and ... -
BGA Process Characterization
Ramkumar, S. Manian (NEPCON East Conference, 1996) -
Computer based manufacturing cell control using intelligent sensing system
Ramkumar, S. Manian; Edinbarough, Immanuel (International Conference on Agile Manufacturing, 1998) -
Computer based manufacturing cell control using smart distributed system
Ramkumar, S. Manian; Edinbarough, Immanuel (International Conference on CAD/CAM, Robotics & Factories of the Future, 1998) -
Design, development and simulation of a flexible manufacturing system
Ramkumar, S. Manian; Krishnakumar, G.; Muthukrishnan, S. N. (National Conference on Mechanisms and Machines, 1987) -
Development of a control architecture for web-based control of a manufacturing cell
Ramkumar, S. Manian; Edinbarough, Immanuel (FAIM 2000, 2000) -
Development of an interdisciplinary curriculum in electronics desgn and manufacturing
Ramkumar, S. Manian (SME: SME International Conference on Manufacturing Education, 1996) -
DFM/DFA Technique-A Case Study
Ramkumar, S. Manian; Neelakrishnan, S. (Center for Manufacturing Systems Engineering, 1993) -
Effect of deviating from the reflow process window for lead-free assembly
Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: Journal of Surface Mount Technology, 2005)The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ... -
Effect of deviating from the reflow process window for lead-free assembly
Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: SMTA International Conference Proceedings, 2005) -
Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes
Ramkumar, S. Manian; Kannabiran, Anand; Penmatsa, Sreekanth; Ghaffarian, Reza (ASME: Proceedings of the ASME InterPack Conference, 2007) -
Effect of solder paste and surface finish on 0201 assembly process defects
Newasekar, Rahul; Ramkumar, S. Manian (SMTA: SMTA International Conference Proceedings, 2004)The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 and even smaller sized passive components. The size advantages of 0201 components make it a popular choice among ... -
Effect of stencil and PCB parameters on 2001 assembly process defects
Ramkumar, S. Manian; Newasekar, Rahul; Ghaffarian, Reza (37th International Symposium on Microelectronics Packaging, IMAPS 2004, 2004) -
Fluid flow modeling for flip chip on board assembly
Venkatraman, P.; Ramkumar, S. Manian (SMTA: SMTA Pan Pacific Microelectronics Symposium, 2002) -
Industry academia partnership-sustaining growth and competitiveness
Ramkumar, S. Manian (PennWell Corporation: SMT Magazine, 2008) -
Investigating the applicability of auto-focus option for optimal oven recipe selection for Pb-Free relow soldering
Ramkumar, S. Manian; Ajmera, Abhinav; Penmatsa, Sreekanth (Megan Wendling: Lead Free Magazine, 2007) -
Investigation of lot variation on moisture sensitivity and its impact on delamination phenomenon in plastic encapsulated components
Ramkumar, S. Manian; Thenalur, Karthik; Anson, Scott (IPC: IPC APEX, 2005) -
Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish
Ramkumar, S. Manian; Kannabiran, Anand; Pannerselvam, Elavarasan (SMTA: SMTA International Conference Proceedings, 2006) -
Investigation of the performance of SAC and SACBi lead-free Solder alloys with OSP and immersion silver PCB finishes
Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Anson, Scott (SMTA: SMTA International Conference Proceedings, 2005) -
Lead free selective soldering process optimization
Ramkumar, S. Manian; Pannerselvam, Elavarasan (SMTA: SMTA International Conference Proceedings, 2007)