Browsing Citations Only by Author "Sampathkumar, Manivannan"
Now showing items 1-3 of 3
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Effect of deviating from the reflow process window for lead-free assembly
Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: Journal of Surface Mount Technology, 2005)The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ... -
Effect of deviating from the reflow process window for lead-free assembly
Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: SMTA International Conference Proceedings, 2005) -
Investigation of the performance of SAC and SACBi lead-free Solder alloys with OSP and immersion silver PCB finishes
Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Anson, Scott (SMTA: SMTA International Conference Proceedings, 2005)