Browsing Citations Only by Subject "Lead-free soldering"

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    • Effect of deviating from the reflow process window for lead-free assembly 

      Ramkumar, S. Manian; Sampathkumar, Manivannan; Rajesnayagham, Santhakumar; Riyaz, Shaik; Anson, Scott (SMTA: Journal of Surface Mount Technology, 2005)
      The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ...