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dc.contributor.authorZheng, S.en_US
dc.contributor.authorEntenberg, Alanen_US
dc.contributor.authorTakacs, Geralden_US
dc.contributor.authorEgitto, F.en_US
dc.contributor.authorMatienzo, L.en_US
dc.date.accessioned2006-07-19T19:59:50Zen_US
dc.date.available2006-07-19T19:59:50Zen_US
dc.date.issued2003-12en_US
dc.identifier.citationJournal of Adhesion Science and Technology 17N13 (2003) 1801-1813en_US
dc.identifier.issn1568-5616en_US
dc.identifier.urihttp://hdl.handle.net/1850/2231en_US
dc.descriptionRIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/
dc.description.abstractPoly(tetrafluoroethylene) (PTFE) film surfaces were exposed to vacuum UV (VUV) radiation from He dc arc plasmas that were made to rotate inside a graphite tube by the application of an auxiliary magnetic field. The films were covered with optical filters having different cutoff wavelengths to vary the VUV radiation that modified the fluoropolymer surface. Photo-etching was detected, as well as surface modification that showed the following: (1) water contact angles decreasing with wavelengths of 173 nm or shorter; (2) surface roughening; (3) defluorination of the surface and formation of cross-linking bonds in the top 10 nm of the surface as detected by XPS analysis; and (4) incorporation of oxygen upon exposure to air. An improvement in the adhesion of copper to these modified surfaces was observed.en_US
dc.format.extent43151 bytesen_US
dc.format.mimetypeapplication/pdfen_US
dc.language.isoen_USen_US
dc.publisherSpringer-Verlag: Journal of Adhesion Science and Technologyen_US
dc.titleAdhesion of copper to poly(tetrafluoroethylene) surfaces modified with vacuum UV radiation from helium arc plasmaen_US
dc.typeAbstracten_US
dc.subject.keywordAdhesionen_US
dc.subject.keywordCopperen_US
dc.subject.keywordPTFEen_US
dc.subject.keywordVacuum ultravioleten_US
dc.identifier.urlhttp://dx.doi.org/10.1163/156856103322538697


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