| dc.contributor.author | Dasilva, W. | en_US |
| dc.contributor.author | Entenberg, Alan | en_US |
| dc.contributor.author | Kahn, B. | en_US |
| dc.contributor.author | Debies, Thomas | en_US |
| dc.contributor.author | Takacs, Gerald | en_US |
| dc.date.accessioned | 2006-07-19T20:00:04Z | en_US |
| dc.date.available | 2006-07-19T20:00:04Z | en_US |
| dc.date.issued | 2004-12 | en_US |
| dc.identifier.citation | Journal of Adhesion Science and Technology 18N12 (2004) 1465-1481 | en_US |
| dc.identifier.issn | 1568-5616 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1850/2232 | en_US |
| dc.description.abstract | Poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces were exposed to vacuum UV (VUV) photo-oxidation downstream from Ar microwave plasma. The modified surfaces showed the following: (1) an improvement in wettability as observed by water contact angle measurements; (2) surface roughening; (3) defluorination of the surface; and (4) incorporation of oxygen as CF—O—CF2, CF2—O—CF2 and CF—O—CF3 moieties. With long treatment times, a cohesive failure of copper sputter-coated onto the modified surface occurred within the modified FEP and not at the Cu–FEP interface. | en_US |
| dc.format.extent | 43151 bytes | en_US |
| dc.format.mimetype | application/pdf | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | Springer-Verlag: Journal of Adhesion Science and Technology | en_US |
| dc.title | Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma | en_US |
| dc.type | Abstract | en_US |
| dc.subject.keyword | Adhesion | en_US |
| dc.subject.keyword | Copper | en_US |
| dc.subject.keyword | FEP | en_US |
| dc.subject.keyword | Photo-oxidation | en_US |
| dc.identifier.url | http://dx.doi.org/10.1163/1568561042323202 | |
