dc.contributor.author | Sener, U. | en_US |
dc.contributor.author | Parekh, Bhavin | en_US |
dc.contributor.author | Entenberg, Alan | en_US |
dc.contributor.author | Debies, Thomas | en_US |
dc.contributor.author | Takacs, Gerald | en_US |
dc.date.accessioned | 2006-07-19T20:00:57Z | en_US |
dc.date.available | 2006-07-19T20:00:57Z | en_US |
dc.date.issued | 2006-03 | en_US |
dc.identifier.citation | Journal of Adhesion Science and Technology 20N4 (2006) 319-334 | en_US |
dc.identifier.issn | 1568-5616 | en_US |
dc.identifier.uri | http://hdl.handle.net/1850/2235 | en_US |
dc.description.abstract | Poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA, Upilex-S) polyimide (PI), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a small change in surface morphology following treatment. XPS showed an approximate doubling of the O/C ratio on the modified surfaces which appeared mostly as the carbonyl moiety. UV photo-oxidation degraded Upilex-S to produce a locus of failure below the interface (cohesive failure). XPS and TOF-SIMS results indicated that the Upilex-S thickness remaining on sputtered Cu after the tape test on the Cu-modified surface was ≤ 10 nm. Cohesive failure occurred at shorter treatment times when Cu was sputter coated on modified BPDA-PDA than on poly(pyromellitic dianhydide-oxydianiline) (PMDA-ODA) PI. | en_US |
dc.format.extent | 43151 bytes | en_US |
dc.format.mimetype | application/pdf | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | Springer-Verlag: Journal of Adhesion Science and Technology | en_US |
dc.title | Surface modification of poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA) polyimide by UV photo-oxidation | en_US |
dc.type | Abstract | en_US |
dc.subject.keyword | Photo-oxidation | en_US |
dc.subject.keyword | Polyimide | en_US |
dc.subject.keyword | Ultraviolet | en_US |
dc.identifier.url | http://dx.doi.org/10.1163/156856106776381776 | |