dc.contributor.author | Kandlikar, Satish | |
dc.contributor.author | Grande, William | |
dc.date.accessioned | 2008-11-04T16:35:11Z | |
dc.date.available | 2008-11-04T16:35:11Z | |
dc.date.issued | 2004 | |
dc.identifier.issn | 0145-7632 | |
dc.identifier.uri | http://hdl.handle.net/1850/7330 | |
dc.description | RIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/ | |
dc.description.abstract | The increased circuit density on today’s computer chips is reaching the heat dissipation limits for
air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative.
This paper reviews liquid cooling with internal flow channels in terms of technological options and
challenges. The possibilities presented herein indicate a four- to ten-fold increase in heat flux over
the air-cooled systems. The roadmap for single-phase cooling technology is presented to identify
research opportunities in meeting the cooling demands of future IC chips. The use of
three-dimensional microchannels that incorporate either microstructures in the channel or grooves
in the channel surfaces may lead to significant enhancements in single-phase cooling. A simplified
and well-established fabrication process is described to fabricate both classes of three-dimensional
microchannels. Proof-of-concept microchannels are presented to demonstrate the efficacy of the
fabrication process in fabricating complex microstructures within a microchannel. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | Taylor & Francis | en_US |
dc.relation.ispartofseries | Vol. 25 | en_US |
dc.relation.ispartofseries | No. 8 | en_US |
dc.title | Evaluation of single phase flow in microchannels for high heat flux chip cooling - thermohydraulic performance enhancement and fabrication technology | en_US |
dc.type | Article | en_US |
dc.identifier.url | http://dx.doi.org/10.1080/01457630490519772 | |