dc.contributor.author | Kandlikar, Satish | |
dc.contributor.author | Grande, William | |
dc.date.accessioned | 2008-11-11T15:20:36Z | |
dc.date.available | 2008-11-11T15:20:36Z | |
dc.date.issued | 2004-06 | |
dc.identifier.uri | http://hdl.handle.net/1850/7421 | |
dc.description | RIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/ | |
dc.description.abstract | The increased circuit density on today’s computer chips
is reaching the heat dissipation limits for air-cooled
technology. Direct liquid cooling of chips is being
considered as a viable alternative. This paper reviews liquid
cooling in terms of technological options and challenges.
The possibilities presented herein indicate a four- to ten-fold
increase in heat flux over the air-cooled systems. The
roadmap for single-phase cooling technology is presented to
identify research opportunities in meeting the cooling
demands of future IC chips. The use of three-dimensional
microchannels that incorporate either microstructures in the
channel or grooves in the channel surfaces may lead to
enhancement in single-phase cooling. A simplified
fabrication process is described that can build both classes
of three-dimensional microchannels. Proof-of-concept
microchannels are presented to demonstrate the efficacy of
the fabrication process. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | American Society of Mechanical Engineers (ASME) | en_US |
dc.title | Evaluation of single phase flow in microchannels for high flux chip cooling - Thermohydraulic performance enhancement and fabrication technology | en_US |
dc.type | Proceedings | en_US |
dc.identifier.url | http://dx.doi.org/10.1080/01457630490519772 | |