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dc.contributor.authorUpadhye, Harshal
dc.contributor.authorKandlikar, Satish
dc.date.accessioned2008-11-11T15:39:25Z
dc.date.available2008-11-11T15:39:25Z
dc.date.issued2004-06
dc.identifier.urihttp://hdl.handle.net/1850/7423
dc.descriptionProceedings of the second international conference on microchannels and minichannels, June 17-19, 2004. The complete proceedings can be found at www.asme.org .en_US
dc.descriptionRIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/
dc.description.abstractDirect cooling of an electronic chip of 25mm x 25mm in size is analyzed as a function of channel geometry for single-phase flow of water through small hydraulic diameters. Fully developed laminar flow is considered with both constant wall temperature and constant channel wall heat flux boundary conditions. The effect of channel dimensions on the pressure drop, the outlet temperature of the cooling fluid and the heat transfer rate are presented. The results indicate that a narrow and deep channel results in improved heat transfer performance for a given pressure drop constraint.en_US
dc.language.isoen_USen_US
dc.publisherAmerican Society of Mechanical Engineers (ASME)en_US
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dc.titleOptimization of microchannel geometry for direct chip cooling using single phase heat transferen_US
dc.typeProceedingsen_US


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