| dc.contributor.author | Steinke, Mark | |
| dc.contributor.author | Kandlikar, Satish | |
| dc.date.accessioned | 2008-11-12T17:44:56Z | |
| dc.date.available | 2008-11-12T17:44:56Z | |
| dc.date.issued | 2002-04 | |
| dc.identifier.uri | http://hdl.handle.net/1850/7455 | |
| dc.description | First proceedings of the international conference on heat transfer, fluid mechanics, and thermodynamics, April 8-10, 2002. The complete proceedings can be found at www.asme.org . | en_US |
| dc.description | RIT community members may access full-text via RIT Libraries licensed databases: http://library.rit.edu/databases/ | |
| dc.description.abstract | The thermal performance of a heat spreader with Phase
Change Material (PCM) is investigated experimentally under
transient conditions. The transient thermal load generated by a
microprocessor is obtained by running a variety of software
applications commonly encountered in Personal Computer
usage. The representative load cycle is used to simulate the
chip with a variable heat source heater. Introducing PCM in
selected pockets of the heat spreader modifies the heat spreader
thermal characteristics. The heat dissipation characteristics of
the air-cooling system mounted on the heat spreader are
maintained constant for all of the experiments. The results
indicate that modifying the thermal characteristics of the heat
spreader improves the maximum heat dissipation rate under
actual transient conditions encountered in PC operation. | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | American Society of Mechanical Engineers (ASME) | en_US |
| dc.relation | RIT Scholars content from RIT Digital Media Library has moved from http://ritdml.rit.edu/handle/1850/7455 to RIT Scholar Works http://scholarworks.rit.edu/other/470, please update your feeds & links! | |
| dc.title | Transient thermal analysis of a microprocessor using a heat spreader with variable thermal storage characteristics | en_US |
| dc.type | Proceedings | en_US |
