dc.contributor.author | JB, MA | |
dc.contributor.author | VanDerveer, William | |
dc.contributor.author | Entenberg, Alan | |
dc.contributor.author | Lindberg, Vern | |
dc.contributor.author | Anschel, M. | |
dc.contributor.author | Shih, Dy | |
dc.contributor.author | Lauro, P. | |
dc.date.accessioned | 2008-11-19T16:24:30Z | |
dc.date.available | 2008-11-19T16:24:30Z | |
dc.date.issued | 1995 | |
dc.identifier.citation | Journal of Adhesion Science and Technology 9 (1995) 487-499 | en_US |
dc.identifier.issn | 0169-4243 | |
dc.identifier.issn | Online: 1568-5616 | |
dc.identifier.uri | http://hdl.handle.net/1850/7548 | |
dc.description.abstract | We have used an extreme environmental stress test to study the adhesion of a thin sputtered copper film (0.5 mu m) to flexible polyimide (PI) substrates between 25 and 125 mu m thick. The polyimide types include Kapton (PMDA-ODA) and Upilex (BPDA-PDA). When there was no surface modification on the PI, the adhesion of the film to Upilex type S was better than the adhesion to Upilex type R or Kapton type HN. When the polymer surface was treated with a simple AC nitrogen glow discharge (NGD), there was an improvement in the adhesion of the film to each of these polyimides. This improvement in adhesion became apparent after the film/substrate combination was subjected to either boiling water or steam for 30 min or more; the difference became quite clear after 2 h. A simple tape test was used to quickly estimate a relative adhesion strength. In order to compare the effect of our AC NGD treatment with other substrate surface modification methods, we used it to improve the coupling of a thick (>10 mu m) layer of copper (via a thin intermediate chromium layer) to a rigid PI substrate, formed from spin coating its precursor onto a silicon wafer. Peel test results were within a factor of 2-3 of the corresponding results obtained with a radio frequency (RF) plasma and ion beam treatments. | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | Brill (VSP): Journal of Adhesion Science and Technology | en_US |
dc.relation.ispartofseries | vol. 9 | en_US |
dc.relation.ispartofseries | no. 4 | en_US |
dc.relation.ispartofseries | pps. 487-499 | en_US |
dc.subject | Adhesion | en_US |
dc.subject | Copper | en_US |
dc.subject | Polymide | en_US |
dc.subject | Temperature | en_US |
dc.subject | Humidity | en_US |
dc.subject | Glow Discharge | en_US |
dc.subject | Plasma modification | en_US |
dc.subject | Enhancement | en_US |
dc.subject | Interfaces | en_US |
dc.title | Use of high-temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface-modified by an AC Nitrogen Glow-Discharge | en_US |
dc.type | Article | en_US |
dc.identifier.url | http://dx.doi.org/10.1163/156856195X00419 | |