Show simple item record

Effect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishes

dc.contributor.authorRamkumar, S. Manian
dc.contributor.authorKannabiran, Anand
dc.contributor.authorPenmatsa, Sreekanth
dc.contributor.authorGhaffarian, Reza
dc.date.accessioned2009-02-19T20:18:58Z
dc.date.available2009-02-19T20:18:58Z
dc.date.issued2007
dc.identifier.urihttp://hdl.handle.net/1850/8378
dc.language.isoen_USen_US
dc.publisherASME: Proceedings of the ASME InterPack Conferenceen_US
dc.titleEffect of forward and backward compatibility of solder paste and component finish on fine pitch component assemblies using ENIG and ImAg PWB finishesen_US
dc.typeProceedingsen_US


Files in this item

Thumbnail
Name:
Unavailable document.doc
Size:
22Kb
Format:
Microsoft Word
View/Open
Thumbnail
Name:
license_url
Size:
49bytes
Format:
Text file
View/Open
Thumbnail
Name:
license_text
Size:
13.84Kb
Format:
Unknown
View/Open
Thumbnail
Name:
license_rdf
Size:
5.089Kb
Format:
Unknown
View/Open

This item appears in the following Collection(s)

Show simple item record