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Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish

dc.contributor.authorRamkumar, S. Manian
dc.contributor.authorKannabiran, Anand
dc.contributor.authorPannerselvam, Elavarasan
dc.date.accessioned2009-02-19T20:19:21Z
dc.date.available2009-02-19T20:19:21Z
dc.date.issued2006
dc.identifier.urihttp://hdl.handle.net/1850/8380
dc.description"Investigation of the Forward and Backward Compatibility of Solder Alloys with Component Finishes for HASL and OSP PCB Finish," SMTA International Conference Proceedings. Held in Chicago, IL: 24-28 September 2006en_US
dc.language.isoen_USen_US
dc.publisherSMTA: SMTA International Conference Proceedingsen_US
dc.titleInvestigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finishen_US
dc.typeProceedingsen_US


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