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A Novel anisotropic conductive adhesive for lead-free surface mount electronics packaging

dc.contributor.authorRamkumar, S. Manian
dc.contributor.authorSrihari, Krishnaswami
dc.date.accessioned2009-02-19T20:20:22Z
dc.date.available2009-02-19T20:20:22Z
dc.date.issued2007
dc.identifier.citationJournal of Electronic Packaging 129N2 (2007) 149-156en_US
dc.identifier.issn1043-7398
dc.identifier.urihttp://hdl.handle.net/1850/8386
dc.language.isoen_USen_US
dc.publisherASME: Journal of Electronic Packagingen_US
dc.relation.ispartofseriesvol. 129en_US
dc.relation.ispartofseriesno. 2en_US
dc.relation.ispartofseriespps. 149-156en_US
dc.titleA Novel anisotropic conductive adhesive for lead-free surface mount electronics packagingen_US
dc.typeArticleen_US
dc.identifier.urlhttp://dx.doi.org/10.1115/1.2721086en_US


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