| dc.contributor.author | Ramkumar, S. Manian | |
| dc.contributor.author | Kannabiran, Anand | |
| dc.contributor.author | Baskaran, Aarthi | |
| dc.date.accessioned | 2009-03-18T17:01:30Z | |
| dc.date.available | 2009-03-18T17:01:30Z | |
| dc.date.issued | 2008 | |
| dc.identifier.citation | Global SMT and Packaging Magazine 8N7 (2008) 12-18 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1850/8615 | |
| dc.description | This article is available at the publisher's website at: http://www.globalsmt.net/ | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | Global SMT and Packaging | en_US |
| dc.relation.ispartofseries | vol. 8 | en_US |
| dc.relation.ispartofseries | no. 7 | en_US |
| dc.relation.ispartofseries | pps. 18 | en_US |
| dc.subject | Thermal Profiling | en_US |
| dc.subject | Reflow Soldering | en_US |
| dc.subject | Reflow Process Window | en_US |
| dc.subject | Process Parameters | en_US |
| dc.subject | Intermetallic Compound | en_US |
| dc.title | Understanding hidden reactions and importance of profile in reflow soldering - part 1 | en_US |
| dc.type | Article | en_US |
