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Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions

dc.contributor.authorRamkumar, S. Manian
dc.contributor.authorSrihari, Krishnaswami
dc.date.accessioned2009-03-18T17:04:31Z
dc.date.available2009-03-18T17:04:31Z
dc.date.issued2006
dc.identifier.urihttp://hdl.handle.net/1850/8631
dc.description"Performance of a Novel Anisotropic Conductive Adhesive under Thermal and Temperature/Humidity Aging Conditions," 39th International Symposium on Microelectronics Packaging, IMAPS 2006. Held in Sand Deigo, California: 8-12 October 2006en_US
dc.language.isoen_USen_US
dc.publisher39th International Symposium on Microelectronics Packaging, IMAPS 2006en_US
dc.titlePerformance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditionsen_US
dc.typeProceedingsen_US


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