Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions
dc.contributor.author | Ramkumar, S. Manian | |
dc.contributor.author | Srihari, Krishnaswami | |
dc.date.accessioned | 2009-03-18T17:04:31Z | |
dc.date.available | 2009-03-18T17:04:31Z | |
dc.date.issued | 2006 | |
dc.identifier.uri | http://hdl.handle.net/1850/8631 | |
dc.description | "Performance of a Novel Anisotropic Conductive Adhesive under Thermal and Temperature/Humidity Aging Conditions," 39th International Symposium on Microelectronics Packaging, IMAPS 2006. Held in Sand Deigo, California: 8-12 October 2006 | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | 39th International Symposium on Microelectronics Packaging, IMAPS 2006 | en_US |
dc.title | Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions | en_US |
dc.type | Proceedings | en_US |