| dc.contributor.author | Ajmera, Abhinav | |
| dc.contributor.author | Sreekanth, Penmatsa | |
| dc.contributor.author | Ramkumar, S. Manian | |
| dc.date.accessioned | 2009-03-18T17:05:16Z | |
| dc.date.available | 2009-03-18T17:05:16Z | |
| dc.date.issued | 2007 | |
| dc.identifier.citation | Global SMT and Packaging Magazine 7N11 (2007) 12-17 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1850/8635 | |
| dc.description | This article can be found at the publisher's website at: http://www.globalsmt.net/ | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | Global SMT and Packaging Magazine | en_US |
| dc.relation.ispartofseries | vol. 7 | en_US |
| dc.relation.ispartofseries | no. 11 | en_US |
| dc.relation.ispartofseries | pps. 12-17 | en_US |
| dc.subject | Thermal profiling | en_US |
| dc.subject | Reducing power consumption | en_US |
| dc.subject | Optimizing oven recipes | en_US |
| dc.subject | Reflow soldering | en_US |
| dc.title | Reducing power conumption by selecting optimal oven recipes | en_US |
| dc.type | Article | en_US |
