Effect of stencil and PCB parameters on 2001 assembly process defects
dc.contributor.author | Ramkumar, S. Manian | |
dc.contributor.author | Newasekar, Rahul | |
dc.contributor.author | Ghaffarian, Reza | |
dc.date.accessioned | 2009-03-18T17:05:29Z | |
dc.date.available | 2009-03-18T17:05:29Z | |
dc.date.issued | 2004 | |
dc.identifier.uri | http://hdl.handle.net/1850/8636 | |
dc.description | "Effect of Stencil and PCB Parameters on 2001 Assembly Process Defects," 37th International Symposium on Microelectronics Packaging, IMAPS 2004. Held in Long Beach, California: 14-18 November 2004 | en_US |
dc.language.iso | en_US | en_US |
dc.publisher | 37th International Symposium on Microelectronics Packaging, IMAPS 2004 | en_US |
dc.title | Effect of stencil and PCB parameters on 2001 assembly process defects | en_US |
dc.type | Proceedings | en_US |