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dc.contributor.authorRamkumar, S. Manian
dc.contributor.authorNewasekar, Rahul
dc.contributor.authorGhaffarian, Reza
dc.date.accessioned2009-03-18T17:05:29Z
dc.date.available2009-03-18T17:05:29Z
dc.date.issued2004
dc.identifier.urihttp://hdl.handle.net/1850/8636
dc.description"Effect of Stencil and PCB Parameters on 2001 Assembly Process Defects," 37th International Symposium on Microelectronics Packaging, IMAPS 2004. Held in Long Beach, California: 14-18 November 2004en_US
dc.language.isoen_USen_US
dc.publisher37th International Symposium on Microelectronics Packaging, IMAPS 2004en_US
dc.titleEffect of stencil and PCB parameters on 2001 assembly process defectsen_US
dc.typeProceedingsen_US


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