Now showing items 1-9 of 9

    • Adhesion of copper to poly(tetrafluoroethylene) surfaces modified with vacuum UV radiation from helium arc plasma 

      Zheng, S.; Entenberg, Alan; Takacs, Gerald; Egitto, F.; Matienzo, L. (Springer-Verlag: Journal of Adhesion Science and Technology, 2003-12)
      Poly(tetrafluoroethylene) (PTFE) film surfaces were exposed to vacuum UV (VUV) radiation from He dc arc plasmas that were made to rotate inside a graphite tube by the application of an auxiliary magnetic field. The films ...
    • Adhesion of copper to poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma 

      Dasilva, W.; Entenberg, Alan; Kahn, B.; Debies, Thomas; Takacs, Gerald (Springer-Verlag: Journal of Adhesion Science and Technology, 2004-12)
      Poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) surfaces were exposed to vacuum UV (VUV) photo-oxidation downstream from Ar microwave plasma. The modified surfaces showed the following: (1) an improvement in wettability ...
    • Adhesion of copper to teflon surfaces modified by vacuum UV photo-oxidation downstream from Ar microwave plasma 

      Dasilva, W.; Entenberg, Alan; Kahn, B.; Debies, Thomas; Takacs, Gerald (The American Chemical Society: Polymeric Materials Science and Engineering, 2004)
      Fluoropolymers, like Teflon(r) PTFE (polytetrafluoroethylene) and FEP (fluorinated ethylene-propylene co-polymer), have been extensively used in space applications, protective coatings, microelectronics packaging and ...
    • Adhesion of copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces modified by vacuum UV photo-oxidation downstream from argon microwave plasma 

      Dasilva, W.; Entenberg, Alan; Kahn, B.; Debies, Thomas; Takacs, Gerald (Materials Research Society Proceedings: Materials for Space Applications, 2005)
      Good practical adhesion of sputter-deposited Cu is achieved to poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces at short treatment times of vacuum UV (VUV) photo-oxidation downstream from Ar ...
    • Photoetching and modification of poly(tetrafluoroethylene-co-hexafluoropropylene) polymer surfaces with vacuum UV radiation 

      Chen, J.; Tracy, D.; Zheng, S.; Xiaolu, L.; Brown, Scott; VanDerveer, William; Entenberg, Alan; Vukanovic, V.; Takacs, Gerald; Egitto, F.; Matienzo, L.; Emmi, F. (Elsevier: Polymer Degradation and Stability, 2003-03)
      Films of poly(tetrafluoroethylene-co-hexafluoropropylene) (FEP) were exposed to radiation from 6.7 x 104 Pa He and Ar dc arc plasmas that were made to rotate inside of a graphite tube by the application of an auxiliary ...
    • RIT Undergraduate Symposium 2005 

      Bodell, A.; Williams, Scott; Ibrahim, Ahmed; Wilson, Jacquelyn; Pagano, Todd; Regula, A.; Robinson, Andrew; Axon, David; Varble, A.; Hammond, W.; Ferran, Maureen; Basener, William; Entenberg, Alan; Talbot, Justin; Debies, T.; Greeson, Nikole; Meade, Jeff; Worman, James; Donahue, Margret; Guggemos, Nick; Cress, Cory; Roberts, M.; Evans, Irene; Parekh, Bhavin; Kurinec, Santosh; Sinisgalli, Natalie; Savka, Michael; Wilson, Richard; Salvaggio, Carl; Mejia, Omar; Smith, Nakesha; Sarchet, S.; Curran, Patrick; Whiting, P.; Xiao, Danny; Walvoord, R.; Landi, Brian; Messinger, David; Korfmacher, Karl; Mueller, E.; Watkins, Amanda; Narayan, Darren; Skuse, Gary; Ewbank, Dale; Okeke, Nkiruka; Denno, P.; Plummer, P.; Langner, Andreas; Collison, Christina; Younker, J.; Wright, G.; Shipman, Paul; Landi, Brian; Barker, S.; Osier, Michael; Scott, Russell; Pearce, D.; Raish, K.; Burr, Thomas; Ballard, Sarah; Loesch, B.; Illingsworth, Marvin; Taylor, Samantha; Erickson, C.; Phillips, Daniel; Brady, B.; Frisina, D. Robert; Delva, E.; Newman, Dina; Sipos, B.; Richter, E.; Ruf, Herbert; DiLeo, Roberta; Raffaelle, Ryne; Daley, Christopher; Koestler, Devin; DeLorenzo, Joseph; Schauerman, C.; Denial, Sarah; Fuller, Lynn; Craig, Paul; Adameck, Julie; Cotman, B.; O'Handley, Suzanne; Hinke, Emma; Wiandt, Tamas; Jaeger, D.; Brandon, J.; Tubbs, Laura; Topley, E.; DeCelles, G.; Doolittle, Richard; Berns, Roy; Gregg, Elizabeth; Franklin, Scott; Buchanan, Catherine; Onyeke, E.; Grande, C.; Kistner, Jason; Clark, Pat; Binotto, E.; Privon, G.; O'Dea, Christopher; Filby, J.; Golebiewski, L.; Brazeau, H.; Baum, Stefi; Kharb, P.; Kohn, J.; Takacs, Gerald; Pappas, Brandi; Thurston, George; Bavelier, Daphne; Guidon, A.; Yi, Hye Yon; Kuhl, Michael; Lowe, Nathaniel; Sheibley, D.; Gallagher, J.; Helguera, Maria; Banach, Steve; Rubenstein, L.; Achtman, R.; Gopal, Shuba; Ramos, J.; Arney, Jonathan; Krysak, Marie; Yi, Ling (2005-08)
      The Undergraduate Research Symposium was founded to honor student achievement in scientific research and to further RIT’s goal of combining traditional laboratory work and classroom instruction with experiential learning. ...
    • Surface modification of poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA) polyimide by UV photo-oxidation 

      Sener, U.; Parekh, Bhavin; Entenberg, Alan; Debies, Thomas; Takacs, Gerald (Springer-Verlag: Journal of Adhesion Science and Technology, 2006-03)
      Poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA, Upilex-S) polyimide (PI), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a small ...
    • Surface modification of Teflon (R) PFA with vacuum UV photo-oxidation 

      Dasilva, W.; Entenberg, Alan; Kahn, Bruce; Debies, Thomas; Takacs, Gerald (Brill Academic Publishers: Journal of Adhesion Science and Technology, 2006)
      Surface modification of poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) with vacuum UV (VUV) photo-oxidation using radiation from excited Ar atoms downstream from an At microwave (MW) plasma shows: (1) an ...
    • Use of high-temperature and high humidity to test the adhesion of sputtered copper to a polyimide surface-modified by an AC Nitrogen Glow-Discharge 

      JB, MA; VanDerveer, William; Entenberg, Alan; Lindberg, Vern; Anschel, M.; Shih, Dy; Lauro, P. (Brill (VSP): Journal of Adhesion Science and Technology, 1995)
      We have used an extreme environmental stress test to study the adhesion of a thin sputtered copper film (0.5 mu m) to flexible polyimide (PI) substrates between 25 and 125 mu m thick. The polyimide types include Kapton ...