Adhesion of copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces modified by vacuum UV photo-oxidation downstream from argon microwave plasma
Date
2005Author
Dasilva, W.
Entenberg, Alan
Kahn, B.
Debies, Thomas
Takacs, Gerald
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Show full item recordAbstract
Good practical adhesion of sputter-deposited Cu is achieved to
poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces at short
treatment times of vacuum UV (VUV) photo-oxidation downstream from Ar microwave
(MW) plasma. Factors contributing to the adhesion include: (1) an improvement in
wettability as observed by water contact angle measurements; (2) surface roughening; (3)
defluorination of the surface; (4) cross-linking at the surface and (5) incorporation of
oxygen as CF-O-CF2, CF2-O-CF2 and CF-O-CnF2n+1 moieties. With long treatment times,
a cohesive failure occurred within the modified PFA and not at the Cu-PFA interface due
to extensive chain scission weakening its mechanical properties.
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