| dc.contributor.author | Dasilva, W. | en_US |
| dc.contributor.author | Entenberg, Alan | en_US |
| dc.contributor.author | Kahn, B. | en_US |
| dc.contributor.author | Debies, Thomas | en_US |
| dc.contributor.author | Takacs, Gerald | en_US |
| dc.date.accessioned | 2006-07-19T20:00:26Z | en_US |
| dc.date.available | 2006-07-19T20:00:26Z | en_US |
| dc.date.issued | 2005 | en_US |
| dc.identifier.citation | Materials for Space Applications 851 (2005) NN9.2.1-NN9.2.6 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1850/2233 | en_US |
| dc.description | Archived at: http://www.mrs.org/s_mrs/sec_subscribe.asp?CID=2723&DID=95820 | en_US |
| dc.description.abstract | Good practical adhesion of sputter-deposited Cu is achieved to
poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces at short
treatment times of vacuum UV (VUV) photo-oxidation downstream from Ar microwave
(MW) plasma. Factors contributing to the adhesion include: (1) an improvement in
wettability as observed by water contact angle measurements; (2) surface roughening; (3)
defluorination of the surface; (4) cross-linking at the surface and (5) incorporation of
oxygen as CF-O-CF2, CF2-O-CF2 and CF-O-CnF2n+1 moieties. With long treatment times,
a cohesive failure occurred within the modified PFA and not at the Cu-PFA interface due
to extensive chain scission weakening its mechanical properties. | en_US |
| dc.format.extent | 26759 bytes | en_US |
| dc.format.mimetype | application/pdf | en_US |
| dc.language.iso | en_US | en_US |
| dc.publisher | Materials Research Society Proceedings: Materials for Space Applications | en_US |
| dc.title | Adhesion of copper to Teflon ® poly(tetrafluoroethylene-co-perfluoropropyl vinyl ether) (PFA) surfaces modified by vacuum UV photo-oxidation downstream from argon microwave plasma | en_US |
| dc.type | Abstract | en_US |
| dc.subject.keyword | Adhesion | en_US |
| dc.subject.keyword | Copper | en_US |
| dc.subject.keyword | Sputter deposition | en_US |
| dc.subject.keyword | Teflon | en_US |
