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Now showing items 11-20 of 38
Modeling and experimental verification of the contact resistance of a novel anisotropic conductive adhesive
(ASME: Proceedings of the ASME International Mechanical Engineering Congress and Exposition, 2007)
The need to eliminate lead-based materials as a means of interconnection has renewed the electronics industry's interest in using conductive adhesives for component attach, especially Anisotropic Conductive Adhesives (ACA). ...
Reducing power conumption by selecting optimal oven recipes
(Global SMT and Packaging Magazine, 2007)
Lead-free 0201 manufacturing, assembly and reliability test results
(Elsevier, 2006)
The trend towards smaller, faster and cheaper electronic devices has led to an increase in the use of 0201 (L not, vert, similar 0.02 in.; W not, vert, similar 0.01 in.) and even smaller sized passive components. The size ...
Investigation of the forward and backward compatibility of solder alloys with component finishes for HASL and OSP PCB finish
(SMTA: SMTA International Conference Proceedings, 2006)
Performance of a novel anisotropic conductive adhesive under thermal and temperature/humidity aging conditions
(39th International Symposium on Microelectronics Packaging, IMAPS 2006, 2006)
Investigation of the performance of SAC and SACBi lead-free Solder alloys with OSP and immersion silver PCB finishes
(SMTA: SMTA International Conference Proceedings, 2005)
Effect of deviating from the reflow process window for lead-free assembly
(SMTA: Journal of Surface Mount Technology, 2005)
The primary objective of this research is to determine the influence of deviating from the standard reflow process window for lead-free soldering. As the industry is moving towards lead-free technology, SAC solder alloy ...
Effect of deviating from the reflow process window for lead-free assembly
(SMTA: SMTA International Conference Proceedings, 2005)
Effect of stencil and PCB parameters on 2001 assembly process defects
(37th International Symposium on Microelectronics Packaging, IMAPS 2004, 2004)