Instabilities in an R-11 thermosiphon loop with applications in microelectronic chip cooling
Abstract
A literature review on the recent applications and developments of thermosiphon loop is
conducted. In particular, systems suitable for cooling of microelectronic chips are
reviewed in greater detail. The advantages of using a thermosiphon loop in microelectronic
applications are discussed. The instability and temperature overshoot at the start-up have
been identified as major problems which require further investigation. An experimental
thermosiphon loop facility is built for preliminary investigations. Qualitative results on
instability and temperature overshoot are obtained by varying the time interval between
shutdown and next start-up. For the conditions of the tests conducted, aging did not
affect the results, but the liquid subcooling and the dissolved gases are suspected to play
an important role in the start-up behavior.
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