Experimental evidence available in the literature indicates that the pool boiling heat transfer with binary mixtures is lower than the respective mole- or mass-fraction averaged value. Although a few investigators have ...

Photographic observations of the boiling phenomena have played an important role in gaining insight into the boiling mechanism. This paper presents a brief historical review of the available literature on the photographic ...

The increased circuit density on today’s computer chips is reaching the heat dissipation limits for air-cooling technology. The direct liquid cooling of chips is being considered as a viable alternative. This paper reviews ...

Flow boiling heat transfer with pure fluids comprises convective and nucleate boiling components. In flow boiling of binary mixtures, in addition to the suppression effects present in pool boiling, the presence of flow ...

The present study is performed to numerically analyze the growth of a vapor bubble during flow of water through a microchannel. The complete Navier- Stokes equations, along with continuity and energy equations, are ...

Heat transfer during flow boiling in minichannels and microchannels is intimately linked to the liquid-vapor phase distribution in the channels. The vapor phase exists as nucleating bubbles, dispersed bubbles, elongated ...

An experimental facility has been developed to investigate single-phase liquid heat transfer and pressure drop in a variety of microchannel geometries. The facility is capable of accurately measuring the fluid temperatures, ...

Abstract The topic of single phase liquid flow in submicron or nanochannels is a nascent field. There have only been a couple papers that have dealt with this area directly. The most probable reason for this is that ...

Heat transfer during flow boiling in minichannels and microchannels is intimately linked to the liquid-vapor phase distribution in the channels. The vapor phase exists as nucleating bubbles, dispersed bubbles, elongated ...

Heat fluxes in IC chips and other electronics equipment have reached the current limits of air-cooling technology. Some of the applications require heat fluxes well beyond the limit of 100 W/cm2, thus demanding advanced ...